Program-controlled diffusion furnace

Product description :
Diffusion furnace cater mostly to semiconductor power electronic device industry, high power integrated circuits and other industries, the processed wafer diffusion, oxidation, annealing, alloy technology. Mainly by diffusion furnace, gas furnace heating systems, control systems, ultra clean operating system and other components. Selection of industrial computer-controlled or programmed operation.

Main technical index: ★ Handle wafer size: 2-8 inches ★ Type forms: horizontal 1-4 tube structure ?? operating temperature: 200 c-1300 c ★ Heated length and accuracy: 200mm-1100mm ≤ ± 0.5 ℃ ?? single point temperature stability, repeatability: ≤ ± 0.5 ℃/24h ★ Temperature deviation: controllable heating rate 20 ° c/min, ★ Controlled cooling rate: 5 c/min ★ Chip device: the automatic push-pull cantilever boat, lever is push-pull boats, manual push-pull ★ Pneumatic system: process gas/1-5 Road tube ★ Gas control: automatic MFC, manual Rotary flow meter ★ Control: IPC, touch screen