Vertical diffusion furnace

This equipment is mainly used in integrated circuits, discrete semiconductor fusion welding, electric and electronic devices for the production, proliferation, sintering, annealing and heat treatment operations.

Main technical index:
Type: vertical, wall, central heating, Bell lifting, screw the upper and lower transmission, automatic lift feed, vacuum chamber with a workpiece support

Wafer size: 2-8 inches

Temperature area: 400-800mm

Working temperature: 400-1250 °

Temperature control accuracy: ± 1 degree

Work space: high 700mm ￠ 350*, (this size can be produced according to the technical requirements)

Vacuum unit: 2x-8 mechanical pump + Turbo-molecular pump (or diffusion pump)

Vacuum: vacuum 5*10-4 limit.

Process gas: N2/H2/Ar/O2 (according to process requirement option);

Pressure: 0.02-0.2mpa

Cooling water: pressure 0.2-0.4MPa

Power supply voltage: 380V power: 22KW

Features:

Chinese Windows interface, you can edit the parameters, convenient operation.
★ You can save multiple technological curves, each curve to set up multiple steps.
★ Technology for automatic operation control function.
★ Automatic running can pause/resume function.
★ Are forced to jump to the next process step in the process running function.
★ Intelligent temperature slope function.
★ PID parameters auto-tuning function.
Fault detection and alarm system.
★ Run after power failure the breakpoint function.
★ Process gas process control functions (solenoid valves/mass flow controller).
★ You can increase or decrease according to users ' special requirements or develop the corresponding function.