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Diffusion furnace application instructions

编辑:Qingdao Yu hao microelectronics equipment co  时间:2016-02-02

Diffusion furnace for large scale integrated circuits and discrete devices, electric and electronic, optoelectronic devices and fiber optics industries such as diffusion, oxide, annealing, alloy and sintering processes.

Diffusion process is used in semiconductor wafers are doped under high temperature conditions, phosphorus and boron diffusion into Silicon, thus changing the type, concentration and control of impurities in the semiconductor and distribution, in order to establish different feature areas.

Latest low phosphorus diffusion sheet resistance of low pressure atmosphere can get better uniformity and greater production volume, and minimize the impact on the environment.

Process is to make the wafer surface under high temperature oxide react with oxidants, grow a layer of silicon dioxide film.

Oxidation of oxygen-oxygen-dry and wet, wet oxygen include the synthesis of hydrogen and oxygen and water vapor oxidation in two ways.

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